• Foundation for Learning Teaching and Research (fLTR) organized by Green University of Bangladesh.

Electronics and Communication Engineering.

Journal paper

[1] Tama Fouzder, Asit Kumar Gain, Daniel K. Chan, “Microstructure, wetting characteristics and hardness of tin-bismuth-silver (Sn–Bi–Ag) solders on silver (Ag)-surface finished copper (Cu) substrates” Journal of Materials Science: Materials in Electronics 28 (2017), pp. 16921-16931.(IF=2.8)

[2] Tama Fouzder, Qingqian Li, Y.C. Chan, Daniel K. Chan, “Microstructure and kinetic analysis of the properties and behavior of nickel (Ni) nano-particle doped tin-zinc-bismuth (Sn-8Zn-3Bi) solders on immersion silver (Ag)-plated copper (Cu) substrates” Journal of Materials Science: Materials in Electronics, 25, (2014), pp. 2529-2539. (IF=2.8)

[3] Tama Fouzder, Qingqian Li, Y.C. Chan, Daniel K. Chan “Interfacial microstructure and hardness of nickel (Ni) nanoparticle-doped tin-silver-copper (Sn-Ag-Cu) solders on immersion silver (Ag)-plated copper (Cu) substrates” Journal of Materials Science: Materials in Electronics, 25, (2014), pp.4012-4023. (IF=2.8)

[4] Tama Fouzder, Y.C. Chan, Daniel K. Chan “Influence of cerium oxide (CeO2) nanoparticles on the microstructure and hardness of tin-silver-copper (Sn-Ag-Cu) solders on silver (Ag) surface-finished copper (Cu) substrates”  Journal of Materials Science: Materials in Electronics, 25 (2014), pp.5375-5387. (IF=2.8)

[5] Tama Fouzder, Ismathullakhan Shafiq, Y.C. Chan, A. Sharif, Winco K.C. Yung “Influence of SrTiO₃ nano-particles on the microstructure and shear strength of Sn–Ag–Cu solder on Au/Ni metallized Cu pads” Journal of Alloys and Compounds 509, (2011), pp.1885-1892. (IF=6.2)

[6] Asit Kumar Gain, Tama Fouzder, Y. C. Chan, Ahmed Sharif, Winco K. C. Yung “Microstructure, kinetic analysis and hardness of Sn–Ag–Cu–1 wt% nano-ZrO₂ composite solder on OSP-Cu pads Original” Journal of Alloys and Compounds 509 (2011), pp. 3319–3325. (IF=6.2)

[7] Tama Fouzder, Asit Kumar Gain, Y. C. Chan, A. Sharif , Winco K. C. Yung “Effect of nano Al₂O₃ additions on the microstructure, hardness and shear strength of eutectic Sn–9Zn solder on Au/Ni metallized Cu pads” Microelectronics Reliability 50, (2010), pp. 2051–2058. (IF=1.6)

[8] Asit Kumar Gain, Tama Fouzder, Y. C. Chan, Ahmed Sharif, Winco K. C. Yung, “Investigation of Small Sn-3.5Ag-0.5Cu Additions on the Microstructure and Properties of Sn–8Zn-3Bi Solder on Au/Ni/Cu pads” Journal of Alloys and Compounds, Vol. 489, (2010), pp.678–684. (IF=6.2)

[9] Asit Kumar Gain, Tama Fouzder, Y. C. Chan, A. Sharif, N. B. Wong, Winco K. C. Yung “The influence of addition of Al nano-particles on the microstructure and shear strength of eutectic Sn-Ag-Cu solder on Au/Ni metallized Cu pads” Journal of Alloys and Compounds 506 (2010), pp. 216–223. (IF=6.2)

[10] Mansur Ahmed, Tama Fouzder, A. Sharif, Asit Kumar Gain, Y. C. Chan, “Influence of Ag micro-particle additions on the microstructure, hardness and tensile properties of Sn-Zn binary eutectic solder alloy” Microelectronics Reliability 50 (2010), pp. 1134–1141. (IF=1.6)

[11] Paromita Chakraborty, P.G. Vinod, Jabir Hussain Syed, Balram Pokhrel, Girija Bharat, Avanti Roy Basu, Tama Fouzder, Mukesh Pasupuleti, Magdalena Urbaniak, Beskoski Vladimir, “Need for monitoring of sewage and wastewater treatment plants or discharge points as a source for spread of novel coronavirus SARS-CoV-2 in the Indus-Ganga- Brahmaputra River Basin” Ecohydrology & Hydrobiology 22(2) , pp.  283–294 (2021) (IF=3.215)

[12] Muhammad Ibrahim, Omer Mujahid, Najib Ur Rehman, Sayyar Ahmad, Azhar Qazi, Zahid Ullah and Tama Fouzder, “ FPGA-based Accelerated Mutation Detection System for the Tumor Suppressor Gene” IEEE Access ” 9 (2021), pp. 164542-164549 (IF=3.9).

[13] F Malook, O Mujahid, Z Ullah, T Fouzder, “On Enhancing the Performance of IEEE 802.11ah by Employing a Dynamic Raw Approach in IoT Networks”, Wireless Personal communications 192 (2023) pp. 1983-1997 (IF: 2.2)

[14] Hua Xiao , Tama Fouzder , Jiacheng Ruan , Caiming Sun , and Wensong Wang, “Optical Spectral Modulation of CdSe/ZnS Quantum Dots Based UAV Identification” IEEE Transactions on Instrumentation & Measurement (2024) (IF: 5.6)

[15]Muhammmad Bilal, Zahid Ullah, Omer Mujahid, Tama Fouzder, “Fast Linde–Buzo–Gray (FLBG) Algorithm for Image Compression through Rescaling Using Bilinear Interpolation” Journal of Imaging 10 (2024) (IF: 2)

[16] Qiannan Jiang, Qiaoyang Zhang, Haiyun Chen, Jiacheng Ruan, Wensong Wang, Tama Fouzder and Ji Wang, Hua Xiao, "Enhancing Light Utilization Efficiency of Dragon Fruit Canopies Using Bi-Directional Adjustable-Focusing LED Lighting System"  Photonics Journal (2025). (IF: 1.9)

Conference Paper

[1] Tama Fouzder, Y.C. Chan, Daniel K. Chan, “Interfacial microstructure and shear strength of Sn-Ag-Cu based composite solders on Cu and Au/Ni metallized Cu substrates” 2014 IEEE 16^th Electronics Packaging Technology Conference, Singapore, December, 2014, p.69-74.

[2] Tama Fouzder, Y.C. Chan, Daniel K. Chan, “Microstructure and Plating Thickness Analysis of Different Surface Finished Plated Printed Circuit Boards” 2012 IEEE 14^th Electronics Packaging Technology Conference, Singapore, December, 2012, p.4-6.

[3] Asit Kumar Gain, Tama Fouzder, Y. C. Chan, Ahmed Sharif, N. B. Wong , Winco K. C. Yung “Effect of additions of metallic (Ag, Ni) nano particles on the microstructure and shear strength of Sn-Zn solder in ball grid array packages” International Conference on Electronics Packaging (ICEP), Japan, May 12~14, 2010 p.337-340.

[4] Asit Kumar Gain, Tama Fouzder, Y. C. Chan, Ahmed Sharif, N. B. Wong, Winco K. C. Yung “Influence of additions of ceramic (ZrO₂, Al₂O₃) nano particles on the microstructure and shear strength of Sn-Ag-Cu solder” International Conference on Electronics Packaging (ICEP), Japan, May 12~14, 2010 p.470-474.

 [5] Methila Biswas Raya, Tama Fouzder, M. Mofazzal Hossain, Khaleda Ali, “Polypropylene Sheet Reinforced Textile Antenna with Reduced Bending Effects” 5^th International Conference on Advances in Electrical Engineering (ICAEE), Bangladesh, September 26-28, 2019.

[6] Mohammad Muntasir Hassan, Mehede Hassan Murad, Tama Fouzder, Sameia Zaman and Md Zunaid Baten, “Absorption Enhancement of GaAs Thin-Film with Geometrically Varying Periodic Array of SiO2 Nanostructures” 3rd IEEE International Conference on Telecommunications and Photonics (ICTP), Bangladesh, December 28-30, 2019.

[7] Muhammad Shafeeq, Muhammad Ibrahim, Zahid Ullah, Abdul Hafeez, Tama Fouzder, “A Wearable Millimeter Wave MIMO Antenna Design for High Frequency Applications” International Conference on Advances in the Emerging Computing Technologies (AECT), Saudi Arabia, February 10-12, 2020.

[8] Najib Ur Rehman, Omer Mujahid, Zahid Ullah, Abdul Hafeez, Tama Fouzder, Muhammad Ibrahim, “ Power Efficient FPGA-based TCAM Architecture by Using Segmented Matchline Strategy” International Conference on Advances in the Emerging Computing Technologies (AECT), Saudi Arabia, February 10-12, 2020.

[9] Omer Mujahid, Zahid Ullah, Abdul Hafeez, Tama Fouzder, “Design Exploration of LH-CAM with Updating Mechanism” 3^rd International Joint Conference on Computational Intelligence (IJCCI), Bangladesh, October 25-26, 2019.

[10] Zahid Ullah, Nasru Minallah, Safdar Nawaz Khan Marwat, Abdul Hafeez, Tama Fouzder, “Analysis of Cache Size and Set-Associativity using simple Scalar Benchmark” 5^th International Conference on Advances in Electrical Engineering (ICAEE), Bangladesh, September 26-28, 2019.

[11]Shawon Chowdhury , Md. Rafiqul Islam , Gazi Md. Shahabuddin, Md. Safi , Muhammad Moshiur Rahman Tarafder and Tama Fouzder, “Modelling and Simulation of Off-Grid Hybrid Power Plant with PV Wind & Diesel Power for Uttar Char Fasson for Latest Data” 10^th IEEE International Conference on Power Systems (ICPS), Cox’s Bazar, Bangladesh, 13-15 December 2023.

 [12] Md. Rafiqul Islam, Md Shipon,  Md. Safi,  Rashedul Islam,  Kanij Ahmad and Tama Fouzder, “Design and Implementation of an Internet of Things (IoT) Based Automation System for Enhancing Laboratory Efficiency” 27th International Conference on Computer and Information Technology (ICCIT)   Cox's Bazar, Bangladesh, 20-22 December 2024.

[13] Kazi Ashikul Haque, Sudipto Pramanik, Tama Fouzder, Muhammad Moshiur Rahman Tarafder and Md. Mahbubur Rahman, “Sustainable Hybrid Cooling for High-Density Electronics: Integrating HFO1234ze Nanofluids, Thermoelectric Cooling, and Heat Pipes” 2025 IEEE International Conference on Electronics, Computing and Communication Technologies (CONECCT), Bengaluru, India, 10-13 July 2025.

[14]Jabed Shariar, Reshad Rayhan, Un Nafeu Rohit, H M Rahad Ahammed and Tama Fouzder, “A Solar-Powered IoT System for Real-Time Water Quality Monitoring Using LoRa and Machine Learning” IEEE 2nd International Conference On Computing, Applications And Systems (COMPASS 2025) Kushtia, Bangladesh, 23-24 October 2025.

[15] Sudipto Pramanik, Sudha Bhattacharjee, Tama Fouzder, Aanan Afsana Azad and Anik Chawdhury, "Enhancing Emotion Classification with Interpretability using LoRA-Finetuned LLaMA-3.2-3B" Presented in 11^th IEEE International Women in Engineering (WIE) Conference on Electrical and Computer Engineering (WIECON-ECE) 21-22 December 2025, Cox’s Bazar, Bangladesh.

[16] Md. Tanvir Hassan, Md. Samiul Islam Mobin, Sourav Karmokar, and Tama Fouzder, " A Low-Cost, Ultra Low-Power, and Scalable LoRa-Based Weather Balloon for Atmospheric Monitoring: A Bangladesh Perspective" Presented in 11^th IEEE International Women in Engineering (WIE) Conference on Electrical and Computer Engineering (WIECON-ECE) 21-22 December 2025, Cox’s Bazar, Bangladesh.

[17] Tariqul Islam, Tama Fouzder, Sudipto Pramanik, Himangshu Ranjan Ghosh, Muhammad Moshiur Rahman Tarafder, "Efficiency Enhancement of Crystalline Silicon Solar Cells via Parameter Optimization Using PC1D Simulation" Presented in 11^th IEEE International Women in Engineering (WIE) Conference on Electrical and Computer Engineering (WIECON-ECE) 21-22 December 2025, Cox’s Bazar, Bangladesh.

Book Chapter

1. Omer Mujahid, Zahid Ullah, Abdul Hafeez, Tama Fouzder, “Design Exploration of LH-CAM with Updating Mechanism, “ Published in Springer Book Chapter: DOI 978-981-15-3607-6_38, © 2020”

Electronic Product Reliability and Electronic Packaging, Lead-free Nano Composite Solders and Final Surface Finish, Antenna Engineering, Wireless Communication, FPGA, Renewable energy.

1. Hong Kong Government Postgraduate Studentship, UGC-Funded, (2012-2015)
2. EPMSE Scholarship, Student Development Service of City University of Hong Kong.

•  IEEE Member: 97020118

Teaching Experience

Associate Professor: 19^th February 2022 to till now.

Department of Electrical and Electronic Engineering, Daffodil International University, Bangladesh.

Assistant Professor: 15^th January 2017 to 6^th February 2022.

Electrical and Electronic Engineering Department, University of Liberal Arts Bangladesh (ULAB).

Research Assistant: 15^th March, 2010 to 10^th December 2010. EPA Centre, Department of Electronic Engineering, City University of Hong Kong, Hong Kong.

Lecturer: 12^th April 2007 to 31^st December 2015.

Electronic and Telecommunication Engineering Department, University of Development Alternative (UODA), Dhaka, Bangladesh.

Teaching Assistant:

Undergraduate Courses: Engineers in Society, City University of Hong Kong. Semester A 2012/13 and Semester A 2013/14

Postgraduate Courses: Green Electronics: Theory, Eco-Design, Experiment and Applications, City University of Hong Kong. Semester B 2012/13, Semester B 2013/14 and Semester B 2014/15

Postgraduate Courses: Reliability Engineering in Electronics Industry, City University of Hong Kong. Semester A 2014/15