Department of Electrical and Electronic Engineering
Dr.Tama Fouzder  Associate Professor
Name :
Dr.Tama Fouzder
Employee ID
710002881
Designation
Associate Professor  
Department
Department of Electrical and Electronic Engineering
Faculty
Faculty of Engineering
Personal Webpage
https://faculty.daffodilvarsity.edu.bd/profile/eee/tamafouzder.html
E-mail
tamafouzder.eee@diu.edu.bd
Phone
Cell-Phone
+8801747744721
Education Passing Year Institution
Ph.D. (Department of Electronic Engineering) February, 2016 City University of Hong Kong, Hong Kong.
B.Sc. in Electronics and Communication Engineering (B. Sc. Engg. ECE) 2006 Science, Engineering & Technology (SET) School.  Khulna University, Khulna-9208, Bangladesh.
Higher Secondary Certificate (Science) 2000 Govt. Girls’ College Khulna,Bangladesh.
Secondary School Certificate (Science) 1998 Govt. Coronation Secondary Girls' School, Khulna, Bangladesh.         
  • Foundation for Learning Teaching and Research (fLTR) organized by Green University of Bangladesh.

Electronics and Communication Engineering.

Journal paper

  1. Tama Fouzder, Asit Kumar Gain, Daniel K. Chan, “Microstructure, wetting characteristics and hardness of tin-bismuth-silver (Sn–Bi–Ag) solders on silver (Ag)-surface finished copper (Cu) substrates” Journal of Materials Science: Materials in Electronics 28 (2017), pp. 16921-16931.(IF=2.478)
  2. Tama Fouzder, Qingqian Li, Y.C. Chan, Daniel K. Chan, “Microstructure and kinetic analysis of the properties and behavior of nickel (Ni) nano-particle doped tin-zinc-bismuth (Sn-8Zn-3Bi) solders on immersion silver (Ag)-plated copper (Cu) substrates” Journal of Materials Science: Materials in Electronics, 25, (2014), pp. 2529-2539. (IF=2.478)
  3. Tama Fouzder, Qingqian Li, Y.C. Chan, Daniel K. Chan “Interfacial microstructure and hardness of nickel (Ni) nanoparticle-doped tin-silver-copper (Sn-Ag-Cu) solders on immersion silver (Ag)-plated copper (Cu) substrates” Journal of Materials Science: Materials in Electronics, 25, (2014), pp.4012-4023. (IF=2.478)
  4. Tama Fouzder, Y.C. Chan, Daniel K. Chan “Influence of cerium oxide (CeO2) nanoparticles on the microstructure and hardness of tin-silver-copper (Sn-Ag-Cu) solders on silver (Ag) surface-finished copper (Cu) substrates”  Journal of Materials Science: Materials in Electronics, 25 (2014), pp.5375-5387. (IF=2.478)
  5. Tama Fouzder, Ismathullakhan Shafiq, Y.C. Chan, A. Sharif, Winco K.C. Yung “Influence of SrTiO3 nano-particles on the microstructure and shear strength of Sn–Ag–Cu solder on Au/Ni metallized Cu pads” Journal of Alloys and Compounds 509, (2011), pp.1885-1892. (IF=5.316)
  6. Asit Kumar Gain, Tama Fouzder, Y. C. Chan, Ahmed Sharif, Winco K. C. Yung “Microstructure, kinetic analysis and hardness of Sn–Ag–Cu–1 wt% nano-ZrO2 composite solder on OSP-Cu pads Original” Journal of Alloys and Compounds 509 (2011), pp. 3319–3325. (IF=5.316)
  7. Tama Fouzder, Asit Kumar Gain, Y. C. Chan, A. Sharif , Winco K. C. Yung “Effect of nano Al2O3 additions on the microstructure, hardness and shear strength of eutectic Sn–9Zn solder on Au/Ni metallized Cu pads” Microelectronics Reliability 50, (2010), pp. 2051–2058. (IF=1.589)
  8. Asit Kumar Gain, Tama Fouzder, Y. C. Chan, Ahmed Sharif, Winco K. C. Yung, “Investigation of Small Sn-3.5Ag-0.5Cu Additions on the Microstructure and Properties of Sn–8Zn-3Bi Solder on Au/Ni/Cu pads” Journal of Alloys and Compounds, Vol. 489, (2010), pp.678–684. (IF=5.316)
  9. Asit Kumar Gain, Tama Fouzder, Y. C. Chan, A. Sharif, N. B. Wong, Winco K. C. Yung “The influence of addition of Al nano-particles on the microstructure and shear strength of eutectic Sn-Ag-Cu solder on Au/Ni metallized Cu pads” Journal of Alloys and Compounds 506 (2010), pp. 216–223. (IF=5.316)
  10. Mansur Ahmed, Tama Fouzder, A. Sharif, Asit Kumar Gain, Y. C. Chan, “Influence of Ag micro-particle additions on the microstructure, hardness and tensile properties of Sn-Zn binary eutectic solder alloy” Microelectronics Reliability 50 (2010), pp. 1134–1141. (IF=1.589)
  11. Paromita Chakraborty, P.G. Vinod, Jabir Hussain Syed, Balram Pokhrel, Girija Bharat, Avanti Roy Basu, Tama Fouzder, Mukesh Pasupuleti, Magdalena Urbaniak, Beskoski Vladimir, “Need for monitoring of sewage and wastewater treatment plants or discharge points as a source for spread of novel coronavirus SARS-CoV-2 in the Indus-Ganga- Brahmaputra River Basin” accepted in Ecohydrology & Hydrobiology (2021) (IF=3.215)
  12. Muhammad Ibrahim, Omer Mujahid, Najib Ur Rehman, Sayyar Ahmad, Azhar Qazi, Zahid Ullah and Tama Fouzder, “ FPGA-based Accelerated Mutation Detection System for the Tumor Suppressor Gene” Accepted in IEEE Access 2021. (IF=3.367)
  13. F Malook, O Mujahid, Z Ullah, T Fouzder, “On Enhancing the Performance of IEEE 802.11ah by Employing a Dynamic Raw Approach in IoT Networks”, Wireless Personal communications (2023) (IF: 2.017)

 

Conference Paper

 

  1. Tama Fouzder, Y.C. Chan, Daniel K. Chan, “Interfacial microstructure and shear strength of Sn-Ag-Cu based composite solders on Cu and Au/Ni metallized Cu substrates” 2014 IEEE 16th Electronics Packaging Technology Conference, Singapore, December, 2014, p.69-74.
  2. Tama Fouzder, Y.C. Chan, Daniel K. Chan, “Microstructure and Plating Thickness Analysis of Different Surface Finished Plated Printed Circuit Boards” 2012 IEEE 14th Electronics Packaging Technology Conference, Singapore, December, 2012, p.4-6.
  3. Asit Kumar Gain, Tama Fouzder, Y. C. Chan, Ahmed Sharif, N. B. Wong , Winco K. C. Yung “Effect of additions of metallic (Ag, Ni) nano particles on the microstructure and shear strength of Sn-Zn solder in ball grid array packages” International Conference on Electronics Packaging (ICEP), Japan, May 12~14, 2010 p.337-340.
  4. Asit Kumar Gain, Tama Fouzder, Y. C. Chan, Ahmed Sharif, N. B. Wong, Winco K. C. Yung “Influence of additions of ceramic (ZrO2, Al2O3) nano particles on the microstructure and shear strength of Sn-Ag-Cu solder” International Conference on Electronics Packaging (ICEP), Japan, May 12~14, 2010 p.470-474.
  5. Methila Biswas Raya, Tama Fouzder, M. Mofazzal Hossain, Khaleda Ali, “Polypropylene Sheet Reinforced Textile Antenna with Reduced Bending Effects” 5th International Conference on Advances in Electrical Engineering (ICAEE), Bangladesh, September 26-28, 2019.
  6. Mohammad Muntasir Hassan, Mehede Hassan Murad, Tama Fouzder, Sameia Zaman and Md Zunaid Baten, “Absorption Enhancement of GaAs Thin-Film with Geometrically Varying Periodic Array of SiO2 Nanostructures” 3rd IEEE International Conference on Telecommunications and Photonics (ICTP), Bangladesh, December 28-30, 2019.
  7. Muhammad Shafeeq, Muhammad Ibrahim, Zahid Ullah, Abdul Hafeez, Tama Fouzder, “A Wearable Millimeter Wave MIMO Antenna Design for High Frequency Applications” International Conference on Advances in the Emerging Computing Technologies (AECT), Saudi Arabia, February 10-12, 2020.
  8. Najib Ur Rehman, Omer Mujahid, Zahid Ullah, Abdul Hafeez, Tama Fouzder, Muhammad Ibrahim, “ Power Efficient FPGA-based TCAM Architecture by Using Segmented Matchline Strategy” International Conference on Advances in the Emerging Computing Technologies (AECT), Saudi Arabia, February 10-12, 2020.
  9. Omer Mujahid, Zahid Ullah, Abdul Hafeez, Tama Fouzder, “Design Exploration of LH-CAM with Updating Mechanism” 3rd International Joint Conference on Computational Intelligence (IJCCI), Bangladesh, October 25-26, 2019.
  10. Zahid Ullah, Nasru Minallah, Safdar Nawaz Khan Marwat, Abdul Hafeez, Tama Fouzder, “Analysis of Cache Size and Set-Associativity using simple Scalar Benchmark” 5th International Conference on Advances in Electrical Engineering (ICAEE), Bangladesh, September 26-28, 2019.

 

Book Chapter

  1. Omer Mujahid, Zahid Ullah, Abdul Hafeez, Tama Fouzder, “Design Exploration of LH-CAM with Updating Mechanism, “ Published in Springer Book Chapter: DOI 978-981-15-3607-6_38, © 2020”

Electronic Product Reliability and Electronic Packaging, Lead-free Nano Composite Solders and Final Surface Finish, Antenna Engineering, Wireless Communication, FPGA, Renewable energy.

  1. Hong Kong Government Postgraduate Studentship, UGC-Funded, (2012-2015)
  2. EPMSE Scholarship, Student Development Service of City University of Hong Kong.

 

  •  IEEE Member: 97020118

Teaching Experience

 

Associate Professor: 19th February 2022 to till now.

Department of Electrical and Electronic Engineering, Daffodil International University, Bangladesh.

Assistant Professor: 15th January 2017 to 6th February 2022.

Electrical and Electronic Engineering Department, University of Liberal Arts Bangladesh (ULAB).

Research Assistant: 15th March, 2010 to 10th December 2010. EPA Centre, Department of Electronic Engineering, City University of Hong Kong, Hong Kong.

Lecturer: 12th April 2007 to 31st December 2015.

Electronic and Telecommunication Engineering Department, University of Development Alternative (UODA), Dhaka, Bangladesh.

 

Teaching Assistant:

Undergraduate Courses: Engineers in Society, City University of Hong Kong. Semester A 2012/13 and Semester A 2013/14

Postgraduate Courses: Green Electronics: Theory, Eco-Design, Experiment and Applications, City University of Hong Kong. Semester B 2012/13, Semester B 2013/14 and Semester B 2014/15

Postgraduate Courses: Reliability Engineering in Electronics Industry, City University of Hong Kong. Semester A 2014/15